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data sheet caution electro-static sensitive devices the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. bipolar analog integrated circuit m m m m pc1694gr general purpose high frequency wideband ic for frequency down-converter document no. p12965ej3v0ds00 (3rd edition) date published october 1999 n cp(k) printed in japan data sheet 1997, 1999 the mark shows major revised points. description the m pc1694gr is silicon monolithic ic for down-converter that is capable of operating up to 1 ghz. this ic consists of double balanced mixer (dbm), local oscillator and if amplifier. furthermore, combination with the m pc1663g (high-speed video amp) enables it to be applied to a fm demodulation circuit such as dbs tuner. the package is 14-pin sop suitable for surface mounting. features ? satisfactory 1% cross-modulation distortion characteristics: cm = 103 db m @ f des = 200 mhz ? wide band operation: f 1 ghz ? easy to connect with varactor diode due to balanced amplifier oscillator ? single-end push-pull if amplifier suppresses fluctuation in output impedance ? supply voltage: 5 v ? packaged in 14-pin sop suitable for smaller mounting area applications ? tuners for tv and vcr ordering information part number package supplying form m pc1694gr-e1 14-pin plastic sop (225 mil) embossed tape 16 mm wide. pin 1 indicates pull-out direction of tape. remark to order evaluation samples, please contact your local nec office. (part number for sample order: m pc1694gr)
data sheet p12965ej3v0ds00 2 m m m m pc1694gr internal block diagram 7 if pre amp. osc buff. nc osc base (feed back) nc 1 if main amp. v cc osc collector (coupling) osc base (bypass) mix. out1 8 gnd mix. osc nc nc 14 if out (75 w const.) rf in2 (bypass) rf in1 mix. out2 pin configuration (top view) 1 2 3 4 5 6 7 14 13 12 11 10 9 8 absolute maximum ratings (t a = +25c) parameter symbol conditions rating unit supply voltage v cc 6.0 v power dissipation p d t a = +85c note 325 mw operating ambient temperature t a C40 to +85 c storage temperature t stg C65 to +150 c note mounted on 50 50 1.6-mm epoxy glass pwb, with copper patterning on both sides. 1. mix output 1 2. gnd (non connection) 3. osc base (bypass) 4. osc base (feedback) 5. osc collector (coupling) (mix/if amp. switch) 6. gnd (non connection) 7. v cc 8. if output (75 w ) 9. gnd 10. rf input 2 (bypass) 11. gnd (non connection) 12. rf input 1 13. gnd (non connection) 14. mix output 2
data sheet p12965ej3v0ds00 3 m m m m pc1694gr recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 4.5 5.0 5.5 v operating ambient temperature t a C40 +25 +85 c electrical characteristics (t a = +25c, v cc = 5 v) parameter symbol test conditions min. typ. max. unit circuit current 1 i cc1 no input signal note 1 32 40 48 ma mixer output voltage v mix 1-14 pin voltage, no input signal note 1 C30 0 +30 mv conversion gain 1 cg1 f rf = 55 to 470 mhz, f if = 50 mhz p rf = C40 dbm rf input terminal: non tuned note 2 14 18 21 db conversion gain 2 cg2 f rf = 470 to 890 mhz, f if = 50 mhz p rf = C40 dbm rf input terminal: non tuned note 3 14 18 21 db noise figure 1 nf1 f rf = 55 to 470 mhz, f if = 50 mhz rf input terminal: non tuned note 2 12.5 15.0 db noise figure 2 nf2 f rf = 470 to 890 mhz, f if = 50 mhz rf input terminal: non tuned note 3 13.5 16.0 db output power 1 p o(sat) 1 f rf = 470 mhz, f if = 50 mhz, p rf = 0 dbm note 2 +8 +10 dbm output power 2 p o(sat) 2 f rf = 890 mhz, f if = 50 mhz, p rf = 0 dbm note 3 +8 +10 dbm circuit current 2 (u/if) i cc2 no input signal note 1 32 40 48 ma power gain (u/if) g p f in = 50 mhz, p in = C40 dbm note 2 17 21 24 db noise figure 3 (u/if) nf3 f in = 50 mhz note 2 12.0 15.0 db notes 1. by test circuit 1 2. by test circuit 2 3. by test circuit 3
data sheet p12965ej3v0ds00 4 m m m m pc1694gr standard characteristics (for reference) (t a = +25c, v cc = 5 v) parameter symbol test conditions reference value unit conversion gain 3 cg3 f rf = 55 mhz, f if = 50 mhz, p rf = C40 dbm rf input terminal: tuned note 1 24.5 db conversion gain 4 cg4 f rf = 200 mhz, f if = 50 mhz, p rf = C40 dbm rf input terminal: tuned note 1 24.5 db conversion gain 5 cg5 f rf = 470 mhz, f if = 50 mhz, p rf = C40 dbm rf input terminal: tuned note 1 23.0 db conversion gain 6 cg6 f rf = 890 mhz, f if = 50 mhz, p rf = C40 dbm rf input terminal: tuned note 2 20.0 db 1% cross-modulation distortion 1 cm1 f rf = 55 to 470 mhz, f if = 50 mhz note 1, 3 103 db m 1% cross-modulation distortion 2 cm2 f rf = 470 to 890 mhz, f if = 50 mhz note 2, 3 100 db m 1% cross-modulation distortion 3 (u/if) cm3 f rf = 50 mhz note 1, 4 103 db m oscillation frequency stability 1 f stb 1 v cc 10%, f osc = 100 to 520 mhz note 1 100 oscillation frequency stability 2 f stb 2 v cc 10%, f osc = 520 to 940 mhz note 2 200 khz oscillation stop (start) voltage 1 v osc 1 f osc = 100 to 520 mhz note 1 2.5 oscillation stop (start) voltage 2 v osc 2 f osc = 520 to 940 mhz note 2 3.0 v notes 1. by test circuit 2 2. by test circuit 3 3. f undes = f rf 12 mhz, p rf = C31 dbm, f if = 50 mhz, am: 100 khz, 30%mod., s/i ratio = 46 dbc, output 75 w open 4. f in = 50 mhz, f undes = 62 mhz, p in = C31 dbm, am: 100 khz, 30% mod., s/i ratio = 46 dbc, output 75 w open
data sheet p12965ej3v0ds00 5 m m m m pc1694gr typical characteristics (t a = +25c) 60 50 40 30 circuit current icc (ma) 20 10 0 123 supply voltage v cc (v) 45 no input signal 6 circuit currnt vs. supply voltage 30 25 20 15 conversion gain cg (db) 10 5 20 18 16 noise figure nf (db) 14 12 10 0 500 1000 v cc = 5 v f if = 50 mhz rf input terminal: no tuned test circuit 2, 3 p rf = ?0 dbm 1200 input frequency f rf (mhz) noise figure and conversion gain vs. input frequency
data sheet p12965ej3v0ds00 6 m m m m pc1694gr 30 25 20 15 conversion gain cg (db) 10 5 0 v cc = 5 v f if = 50 mhz rf input terminal: tuned p rf = ?0 dbm 900 500 200 55 input frequency f rf (mhz) conversion gain vs. input frequency 110 100 90 80 1% cross-modulation distortion cm (db ) m 70 60 0 500 1 000 v cc = 5 v f undes = f rf 12 mhz p rf = ?1 dbm f if = 50 mhz am: 100 khz, 30 % mod. s/i ratio = 46 dbc output 75 w open 1 200 input frequency f rf (mhz) 1% cross-modulation distortion vs. input frequency
data sheet p12965ej3v0ds00 7 m m m m pc1694gr +30 0 output power p out (dbm) ?0 ?0 input power p in (dbm) 0 v cc = 5 v f rf = 470 mhz f if = 50 mhz +20 output power vs. input power +300 0 oscillation frequency stability f stb (khz) ?00 500 0 1000 1200 oscillation frequency f osc (mhz) v cc 10 % v cc ?10 % v cc + 10 % osc-frequency stability vs. oscillation frequency
data sheet p12965ej3v0ds00 8 m m m m pc1694gr test circuit 1 v 14 8 1 470 pf 1 000 pf 1 000 pf v cc = 5 v 7 v a when measuring circuit current with u/if amp, leave pin 5 open.
data sheet p12965ej3v0ds00 9 m m m m pc1694gr test circuit 2 1 20 pf 4 700 pf 1 k w 1 k w l5 l4 l3 1 k w 47 k w hvu306a 47 pf 47 k w 1 h 56 pf m m 3.3 k w 1 000 pf 1 000 pf 0.47 h 1 000 pf 1 000 pf 1 000 pf 1 000 pf 1 000 pf 47 k w 47 to 330 w 10 pf 1.5 pf 1 000 pf l1 l2 20 pf c1 1 000 pf vrf/uif input vrf/uif input if output rf input terminal: tuned ftc vt u = 1 to 29 v ftc v cc 2 (b m2 ) ftc v cc 1 (b m1 ) ftc v cc 4 (b high ) ftc v cc 3 (b hyp ) ftc v cc 5 (b low ) symbol input frequency f rf = 55 mhz f rf = 200 mhz f rf = 470 mhz 8 pf wire diameter bore number of turns : 0.3 mm : 3.5 mm : 23 t f f f f f f f f f f f f f f f f f f wire diameter bore number of turns : 0.5 mm : 3.0 mm : 2 t wire diameter bore number of turns : 0.4 mm : 2.5 mm : 3 t wire diameter bore number of turns : 0.4 mm : 3.0 mm : 9 t wire diameter bore number of turns : 0.4 mm : 3.2 mm : 3 t wire diameter bore number of turns : 0.4 mm : 3.5 mm : 2 t wire diameter bore number of turns : 0.3 mm : 3.5 mm : 32 t wire diameter bore number of turns : 0.3 mm : 4.0 mm : 7 t wire diameter bore number of turns : 0.5 mm : 3.5 mm : 2 t 4 pf 2 pf c1 l1 l2 symbol oscillation frequency coil used l4 l3 l5 f osc = 150 to 300 mhz f osc = 300 to 520 mhz f osc = 100 to 150 mhz v cc 1 (b m1 ) v cc 2 (b m2 ) v cc 3 (b hyp ) v cc 4 (b high ) v cc 5 (b low ) 5 v v low 5 v open open 5 v 5 v v high 5 v open 5 v open 5 v v hyper 5 v 5 v open open 5 v u/if open open open open
data sheet p12965ej3v0ds00 10 m m m m pc1694gr test circuit 3 1 20 pf to 30 pf 47 k w hvu202 4 pf 8 pf 5 pf 5 pf 0.5 pf 1 000 pf 1 000 pf rf input terminal: (f rf = 890 mhz) l 1 : wire diameter: 0.4 mm, bore: 3.0 mm, number of turns: 1 t f f 330 pf 1 000 pf 150 nh 47 w 5 pf 330//4 pf l 1 1 000 pf z o = 200 w = 25 mm uhf/rf input uhf/rf input if output ftc v cc 2 = 5 v ftc v cc 1 = 5 v ftc v tu = 1 to 29 v
data sheet p12965ej3v0ds00 11 m m m m pc1694gr application circuit example 1 for fm demodulator (example using m pc1694gr and m pc1663g) 1 000 pf 1 000 pf 330 pf 10 pf 10 pf 100 pf 100 pf 2 200 pf 2 pf l3 5 pf 6 pf l1 l2 hvu306a hvu306a 1 000 pf balun 180 w trap 47 w 47 w 47 w 47 w 1 k w l1: wire diameter: 0.3 mm, bore: 1.5 mm, number of turns: 13 t l2: wire diameter: 0.4 mm, bore: 3.5 mm, number of turns: 2 t l3: wire diameter: 0.3 mm, bore: 1.8 mm, number of turns: 7 t balun: tdk wbt5,5p5-c10129e f f f f f f 1 k w 47 w 47 w if input video output v cc 1 = 5 v v cc 2 = 10 v 14 1 8 pc1694gr m m 7 45 1 pc1663g lag lead l.p.f. 8
data sheet p12965ej3v0ds00 12 m m m m pc1694gr application circuit example 2 for tv/vcr tuner 1 000 pf 330 pf 1 pf 150 nh 1 pf 5 pf dielectric resonator 47 w if output f if = 58.75 mhz 1 000 pf 330 pf 1st. if input f rf = 954 mhz (from 1st. if amp.) v cc = 5 v 1 000 pf v aft 14 1 8 pc1694gr m 7 input filter att buff. rf amp. prescaler pll 1st. mix. 1st. if filter 1st. if 2nd mix. pc1694gr m 2nd if if output buff. 2nd. l o osc 1st. l o osc
data sheet p12965ej3v0ds00 13 m m m m pc1694gr illustration of the application circuit example 2 assembled on evaluation board (front side) rf1 c1694 1 rf2 osc if 50 mm a' a 69.5 mm v cc 3 (b hyp ) v cc 5 (b low) v cc 4 (b high)
data sheet p12965ej3v0ds00 14 m m m m pc1694gr (back side) b' b v cc 2 (b m2 ) vt u if output l5 l4 l3 v cc 1 (b m1 ) rf, u/if input double-sided glass epoxy board through-holes front and back sides should be matched in a-a' and b-b' : short-circuited strip.
data sheet p12965ej3v0ds00 15 m m m m pc1694gr illustration of the application circuit example 1 assembled on evaluation board (front side) video out 1 if in c1694 c1663 tp2 tp1 50 mm a' a 69.5 mm pc1694gr m
data sheet p12965ej3v0ds00 16 m m m m pc1694gr (back side) b' b v cc 2 v cc 1 video output if input double-sided glass epoxy board through-holes front and back sides should be matched in a-a' and b-b' pc1663g m
data sheet p12965ej3v0ds00 17 m m m m pc1694gr package dimension 14 pin plastic sop (225 mil) 10.2 0.26 1.27 0.10 note each lead centerline is located within 0.10 mm of its true position (t.p.) at maximum material condition. detail of lead end m 17 14 8 1.42 max 6.55 0.2 4.38 0.1 0.6 0.2 1.1 0.16 0.10 0.15 +0.10 ?.05 3 +7 ? 0.40 +0.10 ?.05 1.49 0.1 0.1 1.59 +0.21 ?.20
data sheet p12965ej3v0ds00 18 m m m m pc1694gr note on correct use (1) since this ic uses high frequency process, care is required against the excessive input of static electricity, etc. (2) use the shortest possible wiring for the gnd pin. (3) use the widest possible earth pattern to avoid increase of ground impedance (because it may cause abnormal oscillation). (4) insert a bypass capacitor for the v cc pin (example: 1 000 pf, 2 200 pf, etc.) (5) abnormal oscillation may occur depending on the values of the choke coil and floating capacitance. therefore, insert a resistor between the power supply and choke coil. (see the application circuit example.) recommended soldering conditions this product should be soldered under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nec sales representative. soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235 c or below time: 30 seconds or less (at 210 c) count: 3, exposure limit: none note ir35-00-3 vps package peak temperature: 215 c or below time: 40 seconds or less (at 200 c) count: 3, exposure limit: none note vp15-00-3 wave soldering soldering bath temperature: 260 c or below time: 10 seconds or less count: 1, exposure limit: none note ws60-00-1 partial heating pin temperature: 300 c time: 3 seconds or less (per side of device) exposure limit: none note C note after opening the dry pack, keep it in a place below 25 c and 65 % rh for the allowable storage period. caution do not use different soldering methods together (except for partial heating). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e).
data sheet p12965ej3v0ds00 19 m m m m pc1694gr [memo]
m m m m pc1694gr the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. ? no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. ? nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. ? descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. nec corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. ? while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. ? nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. m7 98. 8

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